Products

Materials for TAB/COF

■ Lead tape （PEI, PI, PET）

■ Lead tape (Photo enlargement)

List of main processing materials

Products Meterial Thickness
Slit copper foil ED copper 9-70μm
RA copper
Laminate and slit products CCL for COF with backup tape According to CCL
Lead tape PET film 50-200μm
PEN film
PI film
PEI film

Polyimide laminate board

Polyimide laminate board which is manufactured by direct bonding of polyimide film which surface is activated by plasma treatment.
Polyimide laminate board exhibits excellent thermal resistance and mechanical properties.

Maximum width Maximum length Maximum thickness
480mm 1,100mm 10mm

Non-adhesive multilayered insulating material

Namli® is a high performance multilayer electric insulating material which is manufactured by direct bonding of heat resistant insulating materials without adhesive.
Namli® has excellent heat resistance, oil resistance, hydrolysis resistance, and thermal conductivity required by motors for EV and HEV vehicles. The process does not emit volatile organic compounds (VOC), contributing to the reduction of global environmental impact.

NSN

Composition
Material Thickness(mil) Thickness(μm)
A NOMEX®（aramid paper） 2・3・5 50・75・125
B TORELINA®（PPS film） 2・3・4・4.5 50・75・100・115
C NOMEX®（aramid paper） 2・3・5 50・75・125
Features
  1. 1）NOMEX® and PPS film “TORELINA®” are bonded without adhesive, and superior performances of NOMEX® and TORELINA® are fully utilized.
  2. 2）NSN is a heat resistant insulating material which exhibits excellent hydrolysis resistance and heat resistance.
  3. 3）NSN is suitable for the insulating materials of motors of EV/HEV and generators.
  4. 4）NSN shows good varnish impregnation performance as NOMEX® is used.

NKN

Composition
Material Thickness(mil) Thickness(μm)
A NOMEX®（aramid paper） 2・3・5 50・75・125
B KAPTON®（polyimide film） 1・2・3・5 25・50・75・125
C NOMEX®（aramid paper） 2・3・5 50・75・125
Features
  1. 1）NKN is a super heat resistant insulating material which exhibits extremely high heat resistance.
  2. 2）Excellent property of KAPTON® is fully utilized.
  3. 3）NKN shows good varnish impregnation performance as NOMEX® is used.

*Nomex® and Kapton® are registered trademarks of DuPont de Nemours, Inc, and TORELINA® is a registered trademark of Toray Industries, Inc. Namli® is a registered trademark of Kawamura Sangyo Co., Ltd.

Solvent-soluble transparent polyimide “KPI-MX300F”

■ Powder

■ Varnish
（Polymer solution）

■ Usage example: film

Features

Properties

State Item Unit Values（mm）
Powder Solvent – MEK,DMAc,
γ-butyrolactone etc.
Properties of film
(Film thickness:
50µm)		 Mechanical
properties		 Tensile modulus GPa 3.9
Elongation % 52
Tensile strength MPa 150
Thermal
properties		 Coefficient of thermal
expansion (CTE)		 ppm／K 43
Glass transition temp (Tg) ℃ 354
5% weight reduction temp ℃ 530
Optical
properties		 Total Transmittance ％ 92
Yellow index (YI) – 1.3
Haze ％ 0.6

*This data is reference values.

Backup tape

Backup tape which shows good removability after heat treatment at high temperature (150℃). This backup tape is suitable for support film of CCL for COF and protection film.

Composition

Layer Material Standard thickness
Base film PET 50µm
Pressure sensitive adhesive (PSA) Acrylic PSA 8µm
Protection film PET 25µm

Properties

Heat treatment condition Adhesion（N/cm） Adhesive residue
Polyimide Glass Polyimide Glass
At room temp 0.02 0.02 none none
150℃×2 hours 0.06 – none –
100℃×1hour – 0.03 – none

Stainless steel／polyimide material

High adhesion due to original polyimide design. Good flatness due to polyimide with low CTE.
Stainless steel/polyimide material is suitable for planar heating elements such as polyimide heater.

Composition

Layer Material Standard thickness
Polyimide Original Polyimide 5-25µm(25µm)
Stainless SUS304 15-50µm(30µm)